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| DATA SHEET BIPOLAR DIGITAL INTEGRATED CIRCUIT PB1505GR 3.0 GHz PRESCALER DIVIDED BY 256, 128, 64 FOR BS/CS TUNER DESCRIPTION PB1505GR is a silicon prescaler IC operating up to 3.0 GHz and divided by 256, 128, 64. Due to 3.0 GHz operation and high division, this IC can contribute to produce BS/CS tuners with kit-use of 17K series DTS controller or standard CMOS PLL IC. The package is 8 pin plastic SOP suitable for surface mounting. This IC is manufactured using NEC's 20 GHz fT NESATTM III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect the chips from external pollution and prevent corrosion/ migration. Thus, this IC has with excellent performance, uniformity and reliability. FEATURES * * * * * High toggle-frequency : 0.5 GHz to 3.0 GHz Low power-consumption : 14 mA TYP. at 5 V High divide-ratio : /256, /128, /64 High input-sensitivity : -14 to +10 dBm @ 1.0 GHz to 2.7 GHz Wide output-swing : 1.6 Vp-p (CL = 8 pF load) ORDERING INFORMATION PART NUMBER PACKAGE 8 pin plastic SOP (225 mil) SUPPLYING FORM Embossed tape 12 mm wide. QTY 2.5 k/reel Pin 1 is in tape pull-out direction. PB1505GR-E1 Remarks To order evaluation samples, please contact your local NEC sales office. (Order number : PB1505GR) PIN ASSIGNMENT (Top View) IN 1 8 IN VCC 2 7 GND SW1 3 6 SW2 OUT 4 5 GND Caution electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P10872EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. (c) 1996,1999 PB1505GR SELECTOR GUIDE FEATURES 2.5 GHz / /512, /256 2.5 GHz / /128, /64 3.0 GHz / /256, /128, /64 PRODUCT NUMBER ICC (mA) 28 26 14 fin (GHz) 0.5 to 2.5 0.5 to 2.5 0.5 to 3.0 VCC (V) 5 5 5 PACKAGE 8 pin SOP 8 pin SOP 8 pin SOP PIN ASSIGNMENT NEC original Typical of prescaler PB586G PB588G PB1505GR Notice Typical performance. Please refer to Electrical Characteristics in detail. To know the associated products, please refer to their latest data sheets. INTERNAL BLOCK DIAGRAM VCC 2 INPUT 1 1 / 64 BYPASS 8 1/2 1/2 Buff. 4 OUTPUT 5, 7 GND 3 SW1 6 SW2 PIN DESCRIPTIONS PIN NO. 1 SYMBOL IN ASSIGNMENT Frequency input pin 2 VCC Power supply pin FUNCTIONS AND EXPLANATION Input frequency from an external VCO output. Must be coupled with capacitor (e.g. 1 000 pF) for DC cut. Supply voltage 5.00.5 V for operation. Must be connected bypass capacitor (e.g. 1 000 pF) to minimize ground impedance. 3 SW1 Divided ratio control input pin 1 SW2 6 SW2 Divided ratio control input pin 2 SW1 L 4 OUT Divided frequency output pin 5 7 GND Ground pin 1/128 1/256 H H 1/64 L 1/128 Divided ratio control can be governed by following input data to these pins. This frequency output can be interfaced to CMOS PLL. Must be coupled with capacitor (e.g. 1 000 pF) for DC cut. This pin must be connected to the system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. (Track length should be kept as short as possible.) 8 IN Frequency-input bypass pin This pin must be connected bypass capacitor (e.g. 1 000 pF) to minimize ground impedance. 2 Data Sheet P10872EJ3V0DS00 PB1505GR ABSOLUTE MAXIMUM RATINGS PARAMETER Supply voltage Input voltage Power dissipation Operating temperature Storage temperature SYMBOL VCC VIN PD Topt Tstg RATING -0.5 to +6 -0.5 to VCC +0.5 250 -40 to +85 -55 to +150 UNIT V V mW C C TA = +25 C TA = +25 C Mounted on 50 x 50 x 1.6 mm double copper clad epoxy glass PWB (TA = +85 C) CONDITIONS RECOMMENDED OPERATING RANGE PARAMETER Supply voltage Operating temperature SYMBOL VCC Topt MIN. 4.5 -40 TYP. 5.0 +25 MAX. 5.5 +85 UNIT V C ELECTRICAL CHARACTERISTICS (TA = -40 to +85 C, VCC = 4.5 to 5.5 V) PARAMETER Circuit current Upper response frequency 1 Upper response frequency 2 Lower response frequency 1 Lower response frequency 2 Input sensitivity 1 Input sensitivity 2 Input sensitivity 3 Output Swing SW1 input voltage (H) SW1 input voltage (L) SW2 input voltage (H) SW2 input voltage (L) SYMBOL ICC fin(U)1 fin(U)2 fin(L)1 fin(L)2 Pin1 Pin2 Pin3 VOUT VIH1 VIL1 VIH2 VIL2 -10 -14 -10 1.3 VCC OPEN VCC OPEN 1.6 VCC OPEN VCC OPEN VCC OPEN VCC OPEN MIN. 9.0 3.0 2.7 0.5 1.0 +8 +10 +10 TYP. 14.0 MAX. 19.5 UNIT mA GHz GHz GHz GHz dBm dBm dBm VP-P V V V V CONDITIONS No input signal Pin = -10 to +10 dBm Pin = -14 to -10 dBm Pin = -10 to +8 dBm Pin = -14 to -10 dBm, +8 to +10 dBm fin = 0.5 to 1.0 GHz fin = 1.0 to 2.7 GHz fin = 2.7 to 3.0 GHz CL = 8 pF Data Sheet P10872EJ3V0DS00 3 PB1505GR TEST CIRCUIT 1 000 pF 1 50 S.G. 2 VCC GND 7 C1 IN IN 8 C4 1 000 pF 3 SW1 SW2 6 1 000 pF 4 C3 OUT GND 5 VCC = +5.0 V 10 % Divided Ratio Control 1 000 pF C2 5 pF C5 1 M 3 pF H SW1 OSCILLOSCOPE L 1/128 1/256 H 1/64 MONITOR SW2 L 1/128 ILLUSTRATION OF TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD KB-1505 IN 1 C 4 VCC C2 C 1 B SW1 SW2 A C 3 C 5 OUT COMPONENT LIST No. C1 to C4 C5 A, B Value 1 000 pF 5 pF shorting chip Note : (*1) 50 x 50 x 0.4 mm double copper clad polyimide board (*2) Back side : GND pattern (*3) Solder plated on pattern (*4) : Through holes (*5) pattern should be removed on this testing. 4 Data Sheet P10872EJ3V0DS00 PB1505GR TYPICAL CHARACTERISTICS (Unless otherwise specified TA = +25 C) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 20 Pin - Input Power Level - dBm INPUT POWER vs. FREQUENCY 40 ICC - Circuit Current - mA 20 VCC = 4.5 to 5.5 V Guaranteed operating range 0 -20 10 -40 -60 VCC = 4.5 to 5.5 V 0.2 0.5 1.0 2.0 5.0 0 2.0 4.0 6.0 VCC - Supply Voltage - V f - Input Frequency - GHz OUTPUT SWING vs. FREQUENCY 2.0 VOUT - Output Swing - VP-P X X X X X X OUTPUT POWER vs. FREQUENCY -6 PO - Output Power Level - dBm X : VCC = 5.5 V TA = -40 C Pin = -10 dBm : VCC = 5.0 V : VCC = 4.5 V 1.8 -8 1.6 X -10 X X X X X X XXX X X X X XX 1.4 X -12 1.2 1.0 X: 0.2 0.5 1.0 VCC = 5.5 V : VCC = 5.0 V : VCC = 4.5 V 2.0 5.0 -14 0.2 0.5 1.0 2.0 5.0 f - Input Frequency - GHz f - Input Frequency - GHz OUTPUT POWER vs. FREQUENCY -6 PO - Output Power Level - dBm PO - Output Power Level - dBm X : VCC = 5.5 V TA = +25 C Pin = -10 dBm : VCC = 5.0 V : VCC = 4.5 V OUTPUT POWER vs. FREQUENCY -6 X : VCC = 5.5 V TA = +85 C Pin = -10 dBm : VCC = 5.0 V : VCC = 4.5 V -8 -8 X X X X XXXX X X X X X -10 X X X X X X XXX X X XX XX -10 X -12 -12 -14 0.2 0.5 1.0 2.0 5.0 -14 0.2 0.5 1.0 2.0 5.0 f - Input Frequency - GHz f - Input Frequency - GHz Data Sheet P10872EJ3V0DS00 5 PB1505GR PACKAGE DIMENSIONS 8 PIN PLASTIC SOP (225 mil) (UNIT: mm) 8 5 detail of lead end 3+7 -3 4 5.2 0.2 6.5 0.3 1.57 0.2 1.49 4.4 0.15 1.1 0.2 1 0.85 MAX. 1.27 0.42 +0.08 -0.07 0.1 0.1 0.12 M 0.6 0.2 0.17 +0.08 -0.07 0.10 NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. 6 Data Sheet P10872EJ3V0DS00 PB1505GR NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the track length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. PB1505GR Soldering method Infrared ray reflow Soldering conditions Package peak temperature : 235 C, Hour : within 30 s. (more than 210 C), Time : 3 time, Limited days : no. * Package peak temperature : 215 C, Hour : within 40 s. (more than 200 C), Time : 3 time, Limited days : no. * Soldering tub temperature : less than 260 C, Hour : within 10 s. Time : 1 time, Limited days : no. * Pin area temperature : less than 300 C, Hour : within 3 s./pin Limited days : no. * Recommended conditoin symbol IR35-00-3 VPS Wave soldering Pin part heating VP-15-00-3 WS60-00-1 * : It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 % RH. Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P10872EJ3V0DS00 7 PB1505GR ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. * The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98.8 |
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